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2021
Presentation
Title
A reference flow for chip-package co-design for 5G-mm-wave using Assembly Design Kit (ADK)
Title Supplement
Presentation held at CadenceLIVE Americas 2021, 08 Jun 2021 - 09 Jun 2021, Online
Abstract
The design effort for upcoming integrated circuit and package technologies is rising because of increasing complexity in production. To cope with that situation it is essential to reuse pre-qualified elements for handle complexity. For package technologies this becomes more and more apparent. Looking at the requirements for 5G applications in a radio frequency up to 60 GHz for package technologies it is no longer feasible to start from scratch. So it becomes more and more import to use prequalified elements for a technology. This paper deals with the implementation of RF-structures for manufacturing and characterization and the how to cover the interaction in the system across IC and different package levels with dedicated tooling. For upcoming package technologies it is getting more and more important to include these devices into so called Assembly Design Kits (ADK) to enable designs by potential customers.In this paper a package that includes two different levels of integration is presented. Package level one is a rdl technology for flip-chip assembly and level two is based on eWLB and is integrated on level one as a package-on-package approach. Both are wafer level package technologies. The paper deals with that technology but the general approach is valid for other package technologies as well.The flow starts with designing within Cadence Virtuoso with multiple modification in terms of addressed frequency and optimization according RF properties like gain, loss or target impedance. The designs are transferred into radio-frequency analysis tools like EMX or Clarity to investigate their behavior on a model basis. This enable the possibility to optimizes the elements according to certain target parameters across technologies.
Conference