Smart sensor systems - packaging technologies for multi-sensory consumer applications

The advent of monolithically integrated systems 'More than Moore' leveraging nanoscale technology for sensors and RF systems as well as the growing maturity of System on Chip (SoC) solutions have increased the function per area significantly. Packaging technology now enables to use these devices in a maximum level of integration, enabling also the use of the third dimension to a paradigm shift towards function per volume.