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Reducing airborne molecular contamination by efficient purging of FOUPs for 300-mm wafers. The influence of material properties
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2000
Journal Article
Title
Reducing airborne molecular contamination by efficient purging of FOUPs for 300-mm wafers. The influence of material properties
Author(s)
Frickinger, J.
Bügler, J.
Zielonka, G.
Pfitzner, L.
Ryssel, H.
Hollemann, S.
Schneider, H.
Journal
IEEE transactions on semiconductor manufacturing
DOI
10.1109/66.892628
Language
English
IIS-B