English
Deutsch
Log In
Log in with Fraunhofer Smartcard
Password Login
Research Outputs
Fundings & Projects
Researchers
Institutes
Statistics
Fraunhofer-Gesellschaft
Home
Fraunhofer-Gesellschaft
Artikel
Rotational grinding of silicon wafers-sub-surface damage inspection
Details
Full
Export
Statistics
Options
Show all metadata (technical view)
2004
Journal Article
Title
Rotational grinding of silicon wafers-sub-surface damage inspection
Author(s)
Haapalinna, Atte
Nevas, Saulius
Pahler, Dietmar
Journal
Materials Science and Engineering, B. Solid state materials for advanced technology
DOI
10.1016/j.mseb.2003.12.008
Language
English
Fraunhofer-Institut für Produktionstechnologie IPT
