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  4. Scalability of OPC-UA down to the chip level enables "Internet of Things"
 
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2013
Conference Paper
Titel

Scalability of OPC-UA down to the chip level enables "Internet of Things"

Abstract
Many implementations of the OPC-UA are increasingly available. Until now, use of technologies like the OPC-UA was limited to embedded systems with a sufficient amount of memory resources. OPC-UA offers a scalable feature set that could be tailored according to application demands. We believe that a key to successfully enable Internet of Things for the industrial automation applications lies in bringing down the OPC-UA into low end resource-limited devices, such as sensors. Because the OPC-UA provides a powerful information representation that is exchangeable through interoperable services. This paper has investigated the OPC-UA as a middleware solution for such resource-limited devices. For a proof of concept we have implemented an OPC-UA server based on the ""Nano Embedded Device Server profiles"" of the OPC Foundation.
Author(s)
Imtiaz, Jahanzaib
Jasperneite, Jürgen
Hauptwerk
11th IEEE International Conference on Industrial Informatics, INDIN 2013. Proceedings
Konferenz
International Conference on Industrial Informatics (INDIN) 2013
Thumbnail Image
DOI
10.1109/INDIN.2013.6622935
Language
English
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Fraunhofer-Institut für Optronik, Systemtechnik und Bildauswertung IOSB
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