Material mechanics and reliability issues of lead-free solder interconnects

2001

Conference Paper

Author(s)

Schubert, A.

Walter, H.

Jung, E.

Gollhardt, A.

Hauptwerk

2nd International Conference on Benefiting from Thermal and Mechanical Simulation in (Micro)-Electronics 2001. Proceedings

Konferenz

International Conference on Benefiting from Thermal and Mechanical Simulation in (Micro)-Electronics (EuroSimE) 2001