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  4. Material mechanics and reliability issues of lead-free solder interconnects
 
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2001
Conference Paper
Titel

Material mechanics and reliability issues of lead-free solder interconnects

Author(s)
Schubert, A.
Walter, H.
Jung, E.
Gollhardt, A.
Hauptwerk
2nd International Conference on Benefiting from Thermal and Mechanical Simulation in (Micro)-Electronics 2001. Proceedings
Konferenz
International Conference on Benefiting from Thermal and Mechanical Simulation in (Micro)-Electronics (EuroSimE) 2001
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Language
English
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