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Material mechanics and reliability issues of lead-free solder interconnects
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2001
Conference Paper
Title
Material mechanics and reliability issues of lead-free solder interconnects
Author(s)
Schubert, A.
Walter, H.
Jung, E.
Gollhardt, A.
Mainwork
2nd International Conference on Benefiting from Thermal and Mechanical Simulation in (Micro)-Electronics 2001. Proceedings
Conference
International Conference on Benefiting from Thermal and Mechanical Simulation in (Micro)-Electronics (EuroSimE) 2001
Language
English
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM
