A highly flexible modular design and production framework for microsystems, suitable for mid-scale production at reasonable costs, was developed. Packaging and assembly of micromodules are discussed. It is shown that, under the given conditions, a vertical assembly concept using already packaged micromodules is the most appropriate choice. Furthermore, a design concept for modular microsystems is presented, which allows users not familiar with microstructuring technologies the design of application-adapted microsystems. The feasibility of the modular approach is demonstrated by the realization of a smart modular pressure sensor combining stackable micromodules, interfaces, plug, and enclosure.
