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  4. Design and Application of Modular Microsystems
 
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1998
Conference Paper
Title

Design and Application of Modular Microsystems

Abstract
A highly flexible modular design and production framework for microsystems, suitable for mid-scale production at reasonable costs, was developed. Packaging and assembly of micromodules are discussed. It is shown that, under the given conditions, a vertical assembly concept using already packaged micromodules is the most appropriate choice. Furthermore, a design concept for modular microsystems is presented, which allows users not familiar with microstructuring technologies the design of application-adapted microsystems. The feasibility of the modular approach is demonstrated by the realization of a smart modular pressure sensor combining stackable micromodules, interfaces, plug, and enclosure.
Author(s)
Schünemann, M.
Bauer, G.
Schäfer, W.
Leutenbauer, R.
Grosser, V.
Zoeppig, V.
Mainwork
Micro System Technologies '98  
Conference
International Conference on Micro-, Electro-, Opto-, Mechanical Systems and Components 1998  
Language
English
Fraunhofer-Institut für Produktionstechnik und Automatisierung IPA  
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM  
Keyword(s)
  • Fertigung

  • Konstruktion

  • Mikrosystem

  • Modulbauweise

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