• English
  • Deutsch
  • Log In
    Password Login
    Research Outputs
    Fundings & Projects
    Researchers
    Institutes
    Statistics
Repository logo
Fraunhofer-Gesellschaft
  1. Home
  2. Fraunhofer-Gesellschaft
  3. Artikel
  4. Low temperature wafer bonding for microsystems using dielectric barrier discharge
 
  • Details
  • Full
Options
2010
Journal Article
Title

Low temperature wafer bonding for microsystems using dielectric barrier discharge

Author(s)
Wünsch, Dirk  
Wiemer, Maik  
Gabriel, M.
Geßner, Thomas  
Journal
MST News  
Language
English
Fraunhofer-Institut für Elektronische Nanosysteme ENAS  
  • Cookie settings
  • Imprint
  • Privacy policy
  • Api
  • Contact
© 2024