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Lifetime prediction of extended flip-chip packages under thermal and mechanical loading
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2001
Conference Paper
Title
Lifetime prediction of extended flip-chip packages under thermal and mechanical loading
Author(s)
Wunderle, B.
Nüchter, W.
Schubert, A.
Michel, B.
Mainwork
2nd International Conference on Benefiting from Thermal and Mechanical Simulation in (Micro)-Electronics 2001. Proceedings
Conference
International Conference on Benefiting from Thermal and Mechanical Simulation in (Micro)-Electronics (EuroSimE) 2001
Language
English
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM
