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  4. ZrAlxOy high-k dielectrics for MIM decoupling capacitors in the BEOL
 
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2023
Conference Paper
Title

ZrAlxOy high-k dielectrics for MIM decoupling capacitors in the BEOL

Abstract
A material, electrical and reliability study of MIM decoupling capacitors placed in the BEOL of 300mm wafers using Al 2 O 3 -doped ZrO 2 dielectric thin films is reported. By using two aluminum contents (7.8% and 13.1%) within thin (<10nm) ZrO 2 dielectric films, the capacitance density of up to 25.7 fF/μm2 with field linearity of 592 ppm/(MV/cm)2 at 10kHz was achieved. J-E curves and dielectric breakdown characteristics at temperatures from 25°C to 150°C were investigated. Low leakage current (<0.1μA/cm2) was achieved up to 200°C for both Al contents. Further, reliability measurements were carried out over temperature (25-175°C). Capacitors reached more than 300 years of extrapolated lifetime for the 13.1% Al content within ZrO 2 at 150°C and up to more than 400 years of lifetime for both Al contents at 25°C.
Author(s)
Falidas, Konstantinos Efstathios  orcid-logo
Fraunhofer-Institut für Photonische Mikrosysteme IPMS  
Mertens, Konstantin
Fraunhofer-Institut für Photonische Mikrosysteme IPMS  
Everding, Maximilian
Fraunhofer-Institut für Photonische Mikrosysteme IPMS  
Czernohorsky, Malte  
Fraunhofer-Institut für Photonische Mikrosysteme IPMS  
Heitmann, J.
Mainwork
International VLSI Symposium on Technology, Systems and Applications, VLSI-TSA/VLSI-DAT 2023. Proceedings of Technical Papers  
Conference
International VLSI Symposium on Technology, Systems and Applications 2023  
DOI
10.1109/VLSI-TSA/VLSI-DAT57221.2023.10134346
Language
English
Fraunhofer-Institut für Photonische Mikrosysteme IPMS  
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