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  4. Submicron InGaAs/InP MSM photodetectors for operation at 1.55 mu m
 
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1995
Conference Paper
Title

Submicron InGaAs/InP MSM photodetectors for operation at 1.55 mu m

Abstract
The implementation of future high-speed optical communication networks operating in the 20-40 Gbit/s regime relies on the availability of correspondingly fast photodetectors for the 1.3-1.55 mu m wavelength range. Interdigitated InGaAs metal-semiconductor-metal (MSM) detectors in the InP material system are promising candidates for wideband photoreceivers due to their inherent lower specific capacitance as compared to p-i-n diodes. MSM photodetectors with submicron (0.3 mu m) feature size fabricated by electron beam lithography on 300 nm InGaAs absorption layer exhibit low dark current (<10 nA), a high external quantum yield (23%) and a frequency response up to 40 GHz at 1.55 mu m.
Author(s)
Umbach, A.
Droge, E.
Engel, H.
Bottcher, E.H.
Unterborsch, G.
Steingrüber, R.
Bimberg, D.
Mainwork
21st European Conference on Optical Communication, ECOC '95. Proceedings. Vol.2: Regular papers & invited papers  
Conference
European Conference on Optical Communication (ECOC) 1995  
Symposium on Photonic versus Electronic Technologies in Switching and Interconnection 1995  
Symposium on Broadband Networks for Video and Multimedia Services 1995  
European Exhibition on Optical Communication (EEOC) 1995  
Language
English
Fraunhofer-Institut für Nachrichtentechnik, Heinrich-Hertz-Institut HHI  
Keyword(s)
  • electron beam lithography

  • gallium arsenide

  • iii-v semiconductors

  • indium compounds

  • metal-semiconductor-metal structures

  • optical communication equipment

  • optical receivers

  • photodetectors

  • submicron msm photodetectors

  • high speed optical communication networks

  • metal-semiconductor-metal detectors

  • wideband photoreceivers

  • specific capacitance

  • submicron feature size

  • absorption layer

  • low dark current

  • high external quantum yield

  • frequency response

  • 0.3 micron

  • 10 na

  • 40 GHz

  • 20 to 40 Gbit/s

  • 1.3 to 1.55 micron

  • InGaAs-InP

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