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  4. Design, manufacture and test for reliable 3D printed electronics packaging
 
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2018
Journal Article
Title

Design, manufacture and test for reliable 3D printed electronics packaging

Abstract
The development of a surrogate modelling approach to aid design of 3D printed electronics packaging structures is presented, alongside a detailed overview of manufacture and reliability of a representative test structure. An overview of the current status in 3D printing in the electronics packaging sector is provided. Subsequently, a surrogate modelling approach for correlating thermomechanical stresses within a package to a number of design parameters is presented. This approach enables the design of a package to be considered in a more insightful manner and can additionally be integrated into condition based monitoring tools capable of enhancing product robustness. An overview of an advanced electronics packaging system capable of 3D printing electronics packages is presented. The system combines inkjet printing and curing of multiple materials, including conductive silver inks, with precision component placement, multi-material dispensing and 3D inspection systems to provide a highly flexible solution for rapid manufacture of electronics packages. Test structures manufactured using the system were subjected to a vigorous set of reliability tests. Details of the test regime and related results are presented. All tests were passed, indicating the robustness of the described manufacturing process. The key originality of the work is that it provides a comprehensive overview of the journey from design assessment an optimisation, through the manufacturing process and on to reliability testing. Areas of novelty in this work are associated with the development of fast, accurate surrogate models able to predict key reliability factors in response to a range of design parameters and insight into the development of a 3D manufacturing system for electronics packaging.
Author(s)
Tilford, Tim
University of Greenwich
Stoyanov, Stoyan
University of Greenwich
Braun, Jessica
Fraunhofer-Institut für Produktionstechnik und Automatisierung IPA  
Janhsen, Jan Christoph  orcid-logo
Fraunhofer-Institut für Produktionstechnik und Automatisierung IPA  
Burgard, Matthias  
Fraunhofer-Institut für Produktionstechnik und Automatisierung IPA  
Birch, Richard
Microsemi Semiconductor Ltd., UK
Bailey, Chris
University of Greenwich
Journal
Microelectronics reliability  
Open Access
DOI
10.1016/j.microrel.2018.04.008
Language
English
Fraunhofer-Institut für Produktionstechnik und Automatisierung IPA  
Keyword(s)
  • Additive Manufacturing (AM)

  • Verpackung

  • Modellierung

  • Zuverlässigkeit

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