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2014
Conference Paper
Title

A broadband 220-320 GHz medium power amplifier module

Abstract
In this paper, we present the development of an ultra-broadband H-band (220 - 325 GHz) submillimeterwave monolithic integrated circuit (S-MMIC) medium power amplifier (MPA) module for use in next generation highresolution imaging systems and communication links operating around 300 GHz. Therefore, a variety of compact amplifier circuits has been developed by using an advanced 35 nm InAlAs/InGaAs based depletion-type metamorphic high electron mobility transistor (mHEMT) technology in combination with grounded coplanar waveguide (GCPW) circuit topology. A three-stage amplifier S-MMIC based on compact cascode devices was realized, demonstrating a maximum gain of 22.2 dB at 294 GHz and a small-signal gain of more than 16 dB over the frequency range from 184 to 312 GHz. Finally, mounting and packaging of the monolithic amplifier chip into a WR-3.4 waveguide module was accomplished with only minor reduction in circuit performance.
Author(s)
Tessmann, Axel  
Fraunhofer-Institut für Angewandte Festkörperphysik IAF  
Leuther, Arnulf  
Fraunhofer-Institut für Angewandte Festkörperphysik IAF  
Hurm, V.
Fraunhofer-Institut für Angewandte Festkörperphysik IAF  
Massler, Hermann
Fraunhofer-Institut für Angewandte Festkörperphysik IAF  
Wagner, Sandrine  
Fraunhofer-Institut für Angewandte Festkörperphysik IAF  
Kuri, Michael  
Fraunhofer-Institut für Angewandte Festkörperphysik IAF  
Zink, Martin  
Fraunhofer-Institut für Angewandte Festkörperphysik IAF  
Riessle, Markus  
Fraunhofer-Institut für Angewandte Festkörperphysik IAF  
Stulz, Hans-Peter  
Fraunhofer-Institut für Angewandte Festkörperphysik IAF  
Schlechtweg, M.
Fraunhofer-Institut für Angewandte Festkörperphysik IAF  
Ambacher, Oliver  
Fraunhofer-Institut für Angewandte Festkörperphysik IAF  
Mainwork
IEEE Compound Semiconductor Integrated Circuit Symposium, CSIC 2014  
Conference
Compound Semiconductor Integrated Circuit Symposium (CSIC) 2014  
DOI
10.1109/CSICS.2014.6978532
Language
English
Fraunhofer-Institut für Angewandte Festkörperphysik IAF  
Keyword(s)
  • H-band

  • medium power amplifier (MPA)

  • metamorphic high electron mobility transistor (mHEMT)

  • microstrip-to-waveguide transition

  • packaging

  • submillimeter-wave monolithic integrated circuit (S-MMIC)

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