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  4. Material Characterization of Advanced Cement-Based Encapsulation Systems for Efficient Power Electronics with Increased Power Density
 
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2018
Conference Paper
Title

Material Characterization of Advanced Cement-Based Encapsulation Systems for Efficient Power Electronics with Increased Power Density

Abstract
The paper introduces novel phosphate cement- and calcium aluminate cement-based material systems with enhanced thermal, mechanical and thermomechanical properties for the encapsulation of power electronic devices and modules. These materials are aiming at improving the high-temperature operation potential of power electronic systems and thus, to promote a successful application of wide bandgap power devices in power electronics. The main focus of the study consists in a thorough material characterization of the novel cement-based encapsulants including high resolution microstructural analysis combined with a modelling approach to support material design optimization. A second task consists in the analysis of interactions of the encapsulants with the electronic material interfaces, e.g. the top-side metallization of power semiconductors, substrate metallizations and bonding wires. Furthermore, power cycling tests coupled with a comprehensive failure analysis have been carried out comparing IGBT power modules with standard silicone gel encapsulation and cement-based encapsulation. The results highlight the potential of the novel cement-based encapsulants on reliability improvements at high-temperature operation.
Author(s)
Böttge, B.
Naumann, F.
Behrendt, S.
Scheibel, M.G.
Kässner, S.
Klengel, S.
Petzold, M.
Nickel, K.G.
Hejtmann, G.
Miric, A.-Z.
Eisele, R.
Mainwork
68th Electronic Components and Technology Conference, ECTC 2018. Proceedings  
Conference
Electronic Components and Technology Conference (ECTC) 2018  
DOI
10.1109/ECTC.2018.00194
Language
English
Fraunhofer-Institut für Mikrostruktur von Werkstoffen und Systemen IMWS  
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