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2022
Conference Paper
Title
200 Gb/s Uncooled EML with Single MQW Layer Stack Design
Abstract
We demonstrate an EML for 200 Gb/s PAM4 modulation at uncooled conditions. The device has an identical MQW layer stack for the DFB, EAM and SOA section, which allows a simple fabrication process. The EML is designed for balanced performance from 20°C to 85°C.
Author(s)