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Impact of layer thickness variations of SOI-wafer on ESD-robustness
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2003
Conference Paper
Title
Impact of layer thickness variations of SOI-wafer on ESD-robustness
Author(s)
Graf, M.
Dietz, F.
Dudek, V.
Bychikhin, S.
Pogany, D.
Gornik, E.
Soppa, W.
Wolf, H.
Mainwork
25th Electrical Overstress/Electrostatic Discharge Symposium 2003. Proceedings
Conference
Annual International Electrical Overstress/Electrostatic Discharge Symposium (EOS/ESD) 2003
Language
English
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM