English
Deutsch
Log In
Log in with Fraunhofer Smartcard
Password Login
Research Outputs
Fundings & Projects
Researchers
Institutes
Statistics
Fraunhofer-Gesellschaft
Home
Fraunhofer-Gesellschaft
Konferenzschrift
Multi-wafer Bonding, Stacking and Interconnecting of Integrated 3-D MEMS Micro Scanners
Details
Full
Export
Statistics
Options
Show all metadata (technical view)
2013
Conference Paper
Title
Multi-wafer Bonding, Stacking and Interconnecting of Integrated 3-D MEMS Micro Scanners
Author(s)
Wiemer, Maik
Wünsch, Dirk
Froemel, J.
Geßner, Thomas
Bargiel, S.
Baranski, M.
Passily, N.
Gorecki, C.
Mainwork
ISMOT 2013. 14th International Symposium in Microwave and Optical Technology. Proceedings
Conference
International Symposium on Microwave and Optical Technology (ISMOT) 2013
Language
English
Fraunhofer-Institut für Elektronische Nanosysteme ENAS
