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  4. Process and equipment simulation of dry silicon etching in the absence of ion bombardment
 
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1999
Journal Article
Titel

Process and equipment simulation of dry silicon etching in the absence of ion bombardment

Author(s)
Otto, T.
Wolf, H.
Streiter, R.
Dehoff, A.
Wandel, K.
Gessner, T.
Zeitschrift
Microelectronic engineering
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DOI
10.1016/S0167-9317(98)00287-1
Language
English
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Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM
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