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Adhesive flip chip technology for telemetric smart cards
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1998
Conference Paper
Titel
Adhesive flip chip technology for telemetric smart cards
Author(s)
Reinert, W.
Harder, T.
Wilm, R.
Kirstenmacher, D.
Hauptwerk
EuPac '98. 3rd European Conference on Electronic Packaging Technology & 9th International Conference on Interconnection Technology in Electronics. Lectures and poster
Konferenz
European Conference on Electronic Packaging Technology (EuPac) 1998
International Conference on Interconnection Technology in Electronics 1998
Language
English
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Fraunhofer-Institut für Siliziumtechnologie ISIT
