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  4. Adhesive flip chip technology for telemetric smart cards
 
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1998
Conference Paper
Title

Adhesive flip chip technology for telemetric smart cards

Author(s)
Reinert, W.
Harder, T.
Wilm, R.
Kirstenmacher, D.
Mainwork
EuPac '98. 3rd European Conference on Electronic Packaging Technology & 9th International Conference on Interconnection Technology in Electronics. Lectures and poster  
Conference
European Conference on Electronic Packaging Technology (EuPac) 1998  
International Conference on Interconnection Technology in Electronics 1998  
Language
English
Fraunhofer-Institut für Siliziumtechnologie ISIT  
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