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Adhesive flip chip technology for telemetric smart cards
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1998
Conference Paper
Title
Adhesive flip chip technology for telemetric smart cards
Author(s)
Reinert, W.
Harder, T.
Wilm, R.
Kirstenmacher, D.
Mainwork
EuPac '98. 3rd European Conference on Electronic Packaging Technology & 9th International Conference on Interconnection Technology in Electronics. Lectures and poster
Conference
European Conference on Electronic Packaging Technology (EuPac) 1998
International Conference on Interconnection Technology in Electronics 1998
Language
English
Fraunhofer-Institut für Siliziumtechnologie ISIT
