Thin chip integration (TCI-modules) - a novel technique for manufacturing three dimensional IC-packages
Abstract
A planar integration technology of ultra-thin bare dice in a Wafer-Level Thin-Film technology to yield a high-dense module is presented here. This Thin Chip Integration (TCI) technology consists of one or more ultra-thin chips which are stacked on a larger sized standard thick chip and which are interconnected by a thin film routing. The dice are glued on a carrier chip on wafer-level. A standard thin film multilayer which was developed for a redistribution process is realized in a planar fashion on top of the embedded system. The metallization is based on a Ti:W / Cu tie layer, which is subsequently electroplated. Cyclotene 4000 is used as interlevel low k dielectric. This unique module concept can lead to new applications that would be not feasible before. It will lead the packaging world to new 3D packages.
