2008
Conference Paper
Titel

Low Temperature Au-Au Flip Chip Interconnections
Author(s)
Pahl, B.
Zwanzig, M.
Fiedler, S.
Kallmayer, C.
Töpper, M.
Schmidt, R.
Aschenbrenner, R.
Reichl, H.
Hauptwerk
Konferenz
Thumbnail Image
Language
English