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Low Temperature Au-Au Flip Chip Interconnections
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2008
Conference Paper
Title
Low Temperature Au-Au Flip Chip Interconnections
Author(s)
Pahl, B.
Zwanzig, M.
Fiedler, S.
Kallmayer, C.
Töpper, M.
Schmidt, R.
Aschenbrenner, R.
Reichl, H.
Mainwork
The IMAPS Nordic Annual Conference 2008
Conference
International Microelectronics and Packaging Society (IMAPS Nordic Annual Conference) 2008
Language
English
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM