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  4. Low Temperature Au-Au Flip Chip Interconnections
 
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2008
Conference Paper
Titel

Low Temperature Au-Au Flip Chip Interconnections

Author(s)
Pahl, B.
Zwanzig, M.
Fiedler, S.
Kallmayer, C.
Töpper, M.
Schmidt, R.
Aschenbrenner, R.
Reichl, H.
Hauptwerk
The IMAPS Nordic Annual Conference 2008
Konferenz
International Microelectronics and Packaging Society (IMAPS Nordic Annual Conference) 2008
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English
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Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM
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