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  4. Low Temperature Au-Au Flip Chip Interconnections
 
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2008
Conference Paper
Title

Low Temperature Au-Au Flip Chip Interconnections

Author(s)
Pahl, B.
Zwanzig, M.
Fiedler, S.
Kallmayer, C.
Töpper, M.
Schmidt, R.
Aschenbrenner, R.
Reichl, H.
Mainwork
The IMAPS Nordic Annual Conference 2008  
Conference
International Microelectronics and Packaging Society (IMAPS Nordic Annual Conference) 2008  
Language
English
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM  
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