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Backside Thinning and Stress-Relief Techniques for Thin Silicon Wafers
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2014
Book Article
Titel
Backside Thinning and Stress-Relief Techniques for Thin Silicon Wafers
Author(s)
Landesberger, C.
Paschke, C.
Spöhrle, H.-P.
Bock, K.
Hauptwerk
Handbook of 3D integration. Vol.3
Language
English
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Fraunhofer-Einrichtung für Mikrosysteme und Festkörper-Technologien EMFT
