Verfahren zum Verbinden von mikromechanischen Wafern

The method involves joining surfaces of protruding structures on the main surface of the wafer to a second wafer using an intermediate carrier with an adhesive layer on its main surface. The first wafer (10) is pressed onto the adhesive surface with the protruding surfaces (14) facing the carrier (15). The wafer is removed from the carrier with some adhesive remaining on the protruding surfaces. The first wafer is applied to the second wafer (20) and joined by the adhesive. The main surface of the intermediate carrier is shaped before the application of the adhesive (17) so that when the first wafer is applied no adhesive can come into contact with it other than on the protruding surfaces. ADVANTAGE - Enables reliable, cost-effective measurement of flows in effluent water channels.