Schneideinrichtung fuer Bodenproben und Verfahren zum schichtweisen Schneiden einer Bodenprobe

The objective of the invention is to facilitate the cutting of soil layers from a soil probe in an uncomplicated manner, said soil probe being treated previously in the lysimeter. According to the invention, a cutting device is provided with a cutting table (5) having a base frame (6) and a cutter plate configuration (7) and a depositing device (10) below the cutter plate configuration (7). The sample holder (1) containing the soil sample (3) is placed on the cutter plate configuration (7) and, after lowering the soil sample (3) onto the depositing device (10) by opening the cutter plate configuration (7), a soil layer (2) is cut from the soil sample (3). The invention is used for investigating soil samples.