Vorrichtung zum Behandeln von Substraten

DE 202006017024 U1 UPAB: 20070426 NOVELTY - The apparatus includes a vacuum chamber (12) containing a low voltage arc discharge source (14,15) which generates a plasma from which charge carriers can be extracted to treat the substrate surface. The substrate (11) is connected to the vacuum chamber. A bias voltage is connected between the substrate and vacuum chamber to accelerate the charge carriers onto the substrate surface and is also applied to an electrode (15) which has a potential close to the plasma potential. USE - For plasma discharge treatment of a substrate surface. ADVANTAGE - Avoids the need for extensive insulation steps between the substrate and the device earth.