Verfahren zur Belotung von Anschlussflaechen, sowie Verfahren zur Herstellung einer Lotlegierung

Process for soldering terminal areas of a substrate with molten solder comprising the following process steps: - placement of the substrate having a surface wettable by solder or having at least a wettable subarea or an otherwise non-wettable surface into a liquid organic medium whose boiling temperature is equal to or above the melting temperature of the solder; - application of the solder onto the terminal area formed as a surface or a subarea in order to form a solder bump, whereby the solder amount allocated to the terminal area is at least within the medium at the time of wetting, and the medium temperature is equal to or above the metling temperature of the solder.