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  4. Verfahren zur Belotung von Anschlussflaechen, sowie Verfahren zur Herstellung einer Lotlegierung
 
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Title

Verfahren zur Belotung von Anschlussflaechen, sowie Verfahren zur Herstellung einer Lotlegierung

Date Issued
1999
Author(s)
Zakel, E.
Patent No
1994-4432774
Abstract
Process for soldering terminal areas of a substrate with molten solder comprising the following process steps: - placement of the substrate having a surface wettable by solder or having at least a wettable subarea or an otherwise non-wettable surface into a liquid organic medium whose boiling temperature is equal to or above the melting temperature of the solder; - application of the solder onto the terminal area formed as a surface or a subarea in order to form a solder bump, whereby the solder amount allocated to the terminal area is at least within the medium at the time of wetting, and the medium temperature is equal to or above the metling temperature of the solder.
Language
de
Institute
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM
Link
http://worldwide.espacenet.com/publicationDetails/biblio?DB=worldwide.espacenet.com&locale=en_EP&FT=D&CC=DE&NR=4432774A
Patenprio
DE 1994-4432774 A: 19940915
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