Verfahren zum Schneiden von Draht- oder Bandmaterial mit Laserstrahlung und Vorrichtung zur Durchfuehrung des Verfahrens

The description refers to a process for the cutting of wire or tape material by means of laser radiation and devices for the performance of the process. The invention is characterized by the fact that the wire or tape material is cut while it moves at speeds up to 100 m/s and more. To enable the laser focus to maintain a constant position in the longitudinal direction of the wire or tape material, the laser focus is moved at the same speed as the wire or tape material and in the same direction and in addition traverse to the said direction in order to perform the cut. A suitable device for this is a rotating hollow cylinder over which the wire or tape meterial runs in several windings. A laser focusing device is provided inside the hollow cylinder and is pushed along guide rails attached in the hollow cylinder in parallel to the cylinder axis and is therefore connected to a drive device outside the hollow cylinder. The laser focusing device has a non-positive attachment to the hollow c ylinder by means of the guide rails in relation to the direction of rotation so that it rotates with the hollow cylinder.