Halbleiterbauelement mit mindestens einer Kontaktstruktur zum Zuführen und/oder Abführen von Ladungsträgern

The invention relates to a semiconductor component having at least one first contact structure for feeding in and/or leading away charge carriers in relation to the semiconductor component, which first contact structure has at least one contact-making point for electrically conductively connecting the first contact structure to an external terminal, and which first contact structure has at least one first-order branching point proceeding from the contact-making point, at which first-order branching point at least one first-order subsequent conduction track branches off. What is essential is that each first-order subsequent conduction track has at least one second-order branching point, at which second-order branching point at least one second-order subsequent conduction track branches off, wherein the electrical through-conduction resistance of each second-order subsequent conduction track is higher than the electrical through-conduction resistance of the first-order subsequent conduction track connected to said second-order subsequent conduction track via a common second-order branching point.