Verfahren und Vorrichtung zur Applikation von Verbindungsmaterial auf einer Substratanschlussflaeche

Process and device for the application of lumpy, in particular ball-shaped connecting material (11) onto a substrate terminal area (12), whereby the connecting material is taken up by a placing device (14) and is then placed on the substrate terminal area, whereby , prior to the placing device (14) placing the connecting material (11), the connecting material is separated and centred in relation to the placing device.