Verfahren und Vorrichtung zur Applikation von Verbindungsmaterial auf einer Substratanschlussflaeche
Date Issued
1996
Author(s)
Zakel, E.
Eldring, J.
Jung, E.
Patent No
1994-4432579
Abstract
Process and device for the application of lumpy, in particular ball-shaped connecting material (11) onto a substrate terminal area (12), whereby the connecting material is taken up by a placing device (14) and is then placed on the substrate terminal area, whereby , prior to the placing device (14) placing the connecting material (11), the connecting material is separated and centred in relation to the placing device.
