CHIPKARTE UND VERFAHREN ZUR HERSTELLUNG EINER CHIPKARTE

WO 9811506 A UPAB: 19980520 A smart card has an embedded integrated circuit module (12) that is mounted on a module carrier (16) to which is bonded an element (14) that increases the inductance level of the arrangement. The carrier has antenna elements (13) formed on the underside and the complete unit is installed in the card. A number of alternative methods of combining the integrated chip and the carrier are possible. ADVANTAGE - Enhanced signal communication.