Integriertes Multi-Sensor-Modul

DE 202007006274 U1 UPAB: 20070927 NOVELTY - The module has a control circuit arranged as integrated circuit on a substrate, and the sensor module has two sensor elements. One of the sensor elements is a micro-electromechanical sensor made of a silicon wafer. The sensor module is designed as surface-mountable construction unit as plated through construction unit. USE - Sensor module. ADVANTAGE - The module has a control circuit arranged as integrated circuit on a substrate. The sensor elements is an micro-electromechanical sensor made of a silicon wafer, thus ensures to provide a sensor module with lower construction volume, and provides an improved load insensitivity of the module.