Verfahren und Vorrichtung zur Herstellung einer loetbaren Metallisierungsschicht auf einer nichtloetbaren Oberflaeche

The invention describes a process for the production of an easily solderable metallization layer on a non-solderable surface. In known processes, in particular for fast oxidizing surfaces such as aluminium, a previous process step is required to destroy the surface oxide layer which is difficult to handle in plasma etching or when using aggressive chemical pickling agents. In the process according to the invention, the oxide layer is broken up and a seeding material is deposited in a simple manner in one step. The seeding material on a substrate is transferred to the aluminium surface by means of energy-rich radiation, whereby the oxide layer is previously broken up by the energy beam and particles of the seeding material are excited by the said beam. Using a reflecting device for the energy beam relative to the non-solderable surface, any desired metallization layer structure can be quickly and precisely applied using seeding material. In order to obtain a subsequent selective metalli zation of the seeded surface areas, no-flow, low-cost mass processes in baths can be preferably used.