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  4. Deckel fuer Mikro-Systeme und Verfahren zur Herstellung eines Deckels
 
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Patent
Title

Deckel fuer Mikro-Systeme und Verfahren zur Herstellung eines Deckels

Other Title
Cover for encapsulation of e.g. micromirror, on wafer plane, has cover unit comprising recess, which is partially limited by optical window, where quadratic surface roughness of window is less than twenty five nanometers
Abstract
(A1) Der erfindungsgemaesse Deckel dient zur Verkapselung von Mikro-Systemen, wobei der Deckel eine oder mehrere Deckeleinheiten aufweist oder daraus besteht und mindestens eine Deckeleinheit mindestens eine durch Verformung bedingte erste Vertiefung aufweist, die zumindest teilweise durch mindestens ein optisches Fenster, dessen quadratische Oberflaechenrauigkeit kleiner/gleich 25 nm ist, begrenzt ist. Des Weiteren ist Gegenstand der Erfindung ein Verfahren zur Herstellung optischer Komponenten, wobei das Verfahren insbesondere auch fuer die Herstellung eines erfindungsgemaessen Deckels, der eine Verkapselung auf Wafer-Ebene ermoeglicht, geeignet ist.

; 

DE 102008012384 A1 UPAB: 20091001 NOVELTY - The cover (22) has a cover unit comprising a recess, which is partially limited by an optical window, where a quadratic surface roughness of the window is less than 25 nanometers. The window is displaceably and inclinedly arranged with respect to a cover base plane, where the cover consists of a glass e.g. silicate glass such as borosilicate glass, and a glass like material. A maximum expansion of the cover is largely equivalent to 150 millimeters, where the cover is provided with a functional surface structure and a refinement coating i.e. antistatic coating, which contains indium tin oxide. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is also included for a method for manufacturing optical components. USE - Cover for use in a semiconductor industry for encapsulation of a microsystem e.g. micro component such as micromirror i.e. movable micromirror (all claimed), acceleration sensor and rotation rate sensor, micromechanical system and microoptical system, on a wafer plane. ADVANTAGE - The cover ensures effective encapsulation of the microsystem in a time and cost saving manner. The utilization of the functional surface structure and the refinement coating improves the functionality of the optical components. The cover ensures sufficient space, movement freedom and less disturbing interference of transmitted radiation.
Inventor(s)
Quenzer, H.
Oldsen, M.
Hofmann, U.
Link to Espacenet
http://worldwide.espacenet.com/publicationDetails/biblio?DB=worldwide.espacenet.com&locale=en_EP&FT=D&CC=DE&NR=102008012384A
Patent Number
102008012384
Publication Date
2008
Language
German
Fraunhofer-Institut für Siliziumtechnologie ISIT  
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