Verfahren zur Abscheidung von Kohlenstoffschichten, Kohlenstoffschichten auf Substraten und deren Verwendung

A process for plasma CVD of a carbon layer on a substrate is carried out by: (a) connecting the substrate to a bipolar voltage source; (b) using a positive pulse duration less than the negative pulse duration; and (c) using a process pressure of 50-1000 Pa. Also claimed is a carbon layer on a substrate, the layer being produced by the above process and having a thickness of 10 nm to 10 mum, an ultra-microhardness of 15-40 GPa. USE - The carbon layer is used as a wear protection layer, a friction reducing layer, a corrosion protection layer and/or a decorative layer (claimed). ADVANTAGE - The process allows uniform coating of parts with complicated geometry (esp. without the need for moving the substrate within the chamber), allows complete and closely-packed filling of the CVD chamber with substrates and produces layers with high harness and wear resistance and low friction coefficient.