Verfahren zum Herstellen eines mikromechanischen Relais

Microminiature relay production involves depositing a fixed conductive electrode (18) on or in the substrate (10). A sacrificial layer (26) is added, then a conductive layer (32), which is structured, depositing a minute strip (39) analogous to a leaf spring of a conventional miniature relay. This will form the moving electrode, which works with the fixed electrode (18). A contact region (40) is applied. The conductive layer (32) extends between an anchoring location and the contact region (40). It is insulated from the contact region (40). The sacrificial layer (26) is then removed by etching, releasing the strip and moving contact structure. USE - To make microminiature relays which may be electrostatically- actuated, using semiconductor industry techniques. ADVANTAGE - The techniques described, allow construction of extremely small relays, which may be electrostatically-driven. Current switching takes place for virtually zero energy consumption. This assumes special significance for portable operation, e.g., of telecommunications systems, where duration may be critical. Because the relays are small, their characteristic impedance can be small at high frequencies. The process used has relatively simple and compact implementation. It is largely independent of the substrate material. Rear etching is eliminated. Use of polyimide permits dry etching techniques to be used. Leaf stressing and initial deflection are precisely controlled, promoting reliable operation.