VERFAHREN UND VORRICHTUNG ZUM TESTEN ODER KALIBRIEREN EINES DRUCKSENSORS AN EINEM WAFER

WO2002101348 A UPAB: 20030214 NOVELTY - A hollow space (38) occurs if needles (40) in a needle card (30) on contact surfaces of a pressure sensor contact the surface (20) of a wafer through a corresponding 3D structure in the needle card and the wafer or it surface. On the bottom side (44) of the needle card there is a soft silicon sealing lip (36) having its outer edge (48) connection with a pressure seal to the bottom side by gluing. DETAILED DESCRIPTION - On the surface of the wafer there are numerous pressure sensors in a grid each with a pressure-sensitive section, an electromechanical transformer and a signal output. INDEPENDENT CLAIMS are also included for the following: (1) a method for producing a pressure sensor component; (2) a device for applying a predefined pressure on a pressure sensor for multiple pressure sensors in a wafer and for picking up a signal from the pressure sensor's signal output. USE - For contacting and testing integrated circuits. ADVANTAGE - The pressure sensors can still be tested or calibrated on a non-detached wafer. This can be done at the same time as a test on the electrical properties of an integrated circuit and their operability.