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Patent
Title
Kuehleinrichtung fuer elektronische Schaltungen
Other Title
Heat pipe for efficient cooling of electronic circuits - comprises heat pipe connected to ceramic evaporation chamber at lower end, with fins at top end, the appts. being hermetically sealed.
Abstract
This cooling unit is esp. suitable for electronic circuits. It comprises a heat pipe, having an evaporation chamber at the lower end, connected to an upper section with cooling fins. The evaporator contains a fluid heat transfer medium. Vaporised medium condenses near the cooling fins, the condensate flowing back to the evaporator. This circuit formed in this way is hermetically-sealed. In this novel unit, the evaporator (5) is ceramic with a thermal conductivity ( lambda ) of at least 90 Wm-1K-1, at 20 deg. C. USE - Used as a heat pipe for efficient, powerful cooling of electronic components. ADVANTAGE - The unit is comparatively silent, has no moving parts, thus requiring no maintenance, and there is rapid transfer of heat without energy consumption. Does not require electrical insulation which spoils cooling. It is not damaged by differential thermal expansion over large temperature ranges, due to the use of a monolithic high thermal conductivity ceramic in the evaporator. Use of wa ter in the heat pipe, improves on conventional fluorinated hydrocarbons, since it transfers heat more effectively. It also presents negligible environmental risk. Use of alcohols allows operation down to -30 deg. C.
Inventor(s)
Toepfer, M.
Brunner, D.
Patent Number
1995-19527674
Publication Date
2000
Language
German