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Title

Vorrichtung zum Greifen von Scheiben und Verwendung der Vorrichtung

Date Issued
2000
Author(s)
Kluge, A.
Zielonka, G.
Fink, J.
Patent No
1998-19802202
Abstract
NOVELTY - The mechanism has two interconnected gripper arms (1,2), which are always in lateral contact with a wafer disc (3) edge at one end. These ends can move radially outwards by pressure, or tension, of the holder. The other ends of the gripper arms are secured in a holder (7). DETAILED DESCRIPTION - There are elastic elements, which can return the ends of the gripper arms into the initial position after release of the holder. The gripper arms are preferably made of titanium. The disc engaging ends of the gripper arms are fitted with slide shoes (5) with recesses for the disc retention. USE - For handling semiconductor wafers, etc. ADVANTAGE - No need for vacuum for reliable, contamination-free gripping of wafer, even of large size.
Language
de
Institute
Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie IISB
Link
http://worldwide.espacenet.com/publicationDetails/biblio?DB=worldwide.espacenet.com&locale=en_EP&FT=D&CC=DE&NR=19802202A
Patenprio
DE 1998-19802202 A: 19980122
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