Elektrisch isolierender Klebstoff, Verfahren zu dessen Herstellung und dessen Verwendung zur Herstellung von elektrisch isolierenden Verklebungen

Electrically insulating adhesive (EIA), obtained by (hydrolytic) condensation of (a) 1-10 mol% silicon compound(s) of formula SiR4 (I), in which R = halogen, OH, alkoxy, acyloxy or a chelate ligand; (b) 20-94 mol% silicon compound(s) of formula R''m(R'''Y)nSiX4-m-n (II), in which R'' = alkyl, alkenyl, aryl, alkaryl aralkyl, alkenylaryl or aralkenyl, optionally with in-chain O, S or NH; R''' = alkylene, alkenylene, arylene, alkarylene, aralkylene, alkenylarylene or aralkenylene, optionally with in-chain O, S or NH; X = halogen, OH, alkoxy, acyloxy or N(R')2 (with R'= H or alkyl); Y = a residue with polymerisable group(s); m = 0, 1, 2 or 3; n = 1, 2 or 3; m + n = 1, 2 or 3; and (c) 5-30 mol% silicon compound(s) of formula R''pSiX4-p (III), in which R'' and X = as above, and p = 1, 2 or 3. Also claimed is a process for the production of EIA by hydrolytic condensation of the above mixture and/or precondensates of the above compounds by the action of moisture or water in presence of solvent and/or catalyst. USE - For the production of electrically insulating adhesive joints (claimed). Applications include microelectronics, (micro)-engineering, optical systems etc. ADVANTAGE - Electrically insulating adhesive which is easily and rapidly used and has excellent bonding properties on inorganic substrates.