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Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM
Laboratory X-ray Microscopy of 3D Nanostructures in the Hard X-ray Regime Enabled by a Combination of Multilayer X-ray Optics
Sensor Systems for Extremely Harsh Environments
Smart sensor systems for extremely harsh environments
HOT-300 - a multidisciplinary technology approach targeting microelectronic systems at 300 °C operating temperature
Sensor Systems for Extremely Harsh Environments
Sensor Systems for Extremely Harsh Environments
Functional integration - structure-integrated wireless sensor technology targeting smart mechanical engineering applications
A novel hermetic encapsulation approach for the protection of electronics in harsh environments
A high temperature SOI-CMOS chipset focusing sensor electronics for operating temperatures up to 300 °C
Characterization of anodic bondable LTCC for wafer-level packaging