Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM

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  • Patent
    Verfahren zur Verbindung eines flexiblen Substrats mit einem Chip
    ( 2004)
    Azdasht, G.
    ;
    Zakel, E.
    ;
    Reichl, H.
    Process for the thermal binding of contact elements (14, 15) of a flexible substrate (10) with contact metallizations (17) of an electronic component (12), whereby the flexible substrate has a substrate (13) made of plastic and the contact elements are applied with energy from their rear, i.e. in the form of a laser beam (11), whereby the transparency of the substrate (19), the absorption of the contact elements (14, 15) and the wavelength of the laser beam (11) are matched so that the laser beam is guided mainly through the substrate (13) and is absorbed in the contact elements (14, 15), and the substrate (10) is applied with pressure in such a way that the contact elements (14, 15) of the substrate (10) and the contact metallizations (17) of the component (12) are in contact with each other when the laser beam (11) is applied to them.
  • Patent
    Kontaktlose Chipkarte
    ( 2003)
    Azdasht, G.
    ;
    Lange, M.
    The chip card (10) has an insulating substrate (12) in which a semiconductor chip (14) is incorporated, together with a coil structure (18) coupled to the semiconductor chip. The connections between the semiconductor chip and the coil structure are formed integral with the latter, with the semiconductor chip recessed into the substrate surface, so that the main surface of the chip lies flush with the substrate surface. USE - For key card used for door or automobile lock. ADVANTAGE - Eliminates need for bonded connections.
  • Patent
    Gehaeustes Bauelement und Verfahren zu dessen Herstellung
    ( 2003)
    Reichl, H.
    ;
    Aschenbrenner, R.
    ;
    Ansorge, F.
    ;
    Becker, K.
    ;
    Ehrlich, R.
    ;
    Oppermann, H.
    ;
    Azdasht, G.
    NOVELTY - At least one component is located and contacted on the first region (102) of the substrate (100). The substrate flexible third region (106) is shaped such that the first and second region (104) are bent together to opposite each other and enclose at least one component. The coupling lines of the component(s) are brought out on a main surface (112) of the first and/or second substrate region outside, when folded over. USE - For dual in line package, quad flat package, multichip module, ball grid array module systems. ADVANTAGE - Small surface required for module assembly and flexible rewiring geometry.
  • Patent
    Verbindungsstruktur
    ( 2002)
    Azdasht, G.
    ;
    Kasulke, P.
    ;
    Badrihafifekr, H.
    ;
    Weiss, S.
    ;
    Zakel, E.
    The components are of materials of different expansion coeffts., and at least one component is an electric power element. High melting material are used for connection structure, forming individual connection elements (29) between the contact faces (27,28) of the component elements (21,22). Preferably each connection element is made of a single material and directly coupled to the contact faces. Typically as a laminated structure. The connection elements may contain an intermediate layer of a soldering material for contacting the opposite contact faces. USE/ADVANTAGE - For electronic power elements, such as laser diodes etc. Reliable reduction of thermally induced stresses without impairing the component service life.
  • Patent
    Verfahren zum Bilden einer strukturierten Metallisierung auf einem Halbleiterwafer
    ( 2002)
    Aschenbrenner, R.
    ;
    Azdasht, G.
    ;
    Zakel, E.
    ;
    Ostmann, A.
    ;
    Motulla, G.
    A process for forming a structured metallisation on a semiconductor wafer (20), in which a passivation layer (22) is applied onto the wafer main surface and is structured to define a bond pad (24), involves (a) producing a metal bump on the bond pad (24); (b) producing an activated dielectric on the passivation layer regions on which the structured metallisation is to be formed; and (c) chemically depositing metal on the activated dielectric and the metal bump. Also claimed are alternative processes involving (i) carrying out step (b), activating the bond pad and chemically depositing metal on the activated regions and the activated bond pad; (ii) producing an activated electrically conductive paste (40) on the bond pad (24) and on the passivation layer regions on which the structured metallisation is to be formed, followed by chemical metal deposition on the paste (40); or (iii) carrying out step (a), producing a structured metal foil on the metal bump and on the passivation layer reg ions on which the structured metallisation is to be formed, followed by chemical metal deposition on the metal foil. USE - Especially for chip wiring production on a semiconductor wafer. ADVANTAGE - Wiring of chip edge pads of the wafer in a planar configuration can be carried out in a simpler, quicker and less expensive manner than conventional processes which employ expensive sputtering operations.
  • Patent
    Chipmodul sowie Verfahren zur Herstellung eines Chipmoduls
    ( 2002)
    Oppermann, H.H.
    ;
    Zakel, E.
    ;
    Azdasht, G.
    ;
    Kasulke, P.
    The chip module (20) has at least one chip (22) attached to a chip carrier (21) provided by a foil and a plastics carrier layer (23), providing a conductor path structure (24) with conductor paths (28) connected to corresponding contact pads (32) of the chip on the front side and provided with external contact regions (26) on the rear side, for connection to a circuit board substrate (31). The external contact regions are provided by openings in the carrier layer of the chip carrier at the rear side of the conductor paths, aligned with terminal pads (30) for the chip provided by the circuit board substrate. USE - For chip-scale package. ADVANTAGE - Simple manufacture of chip module with reduced number of individual steps.
  • Patent
    Verfahren und Vorrichtung zum flussmittelfreien Aufbringen eines Loetmittels auf ein Substrat oder einen Chip
    ( 2001)
    Azdasht, G.
    ;
    Lange, M.
    Flux-free application of a solder sphere (102) to a substrate (104) or a chip (108) involves: (a) preliminary treatment and/or cleaning of a region (140) of the surface to be provided with a solder sphere; (b) isolation of the region (140) by means of protective gas from the surroundings; (c) application of a solder sphere to this region. Also claimed is an apparatus for implementation of the method. USE - Used in manufacture of electronic components, for soldering within the so-called fine pitch range. ADVANTAGE - Solder can be applied to substrate or chip surface without use of flux agents.
  • Patent
    Verfahren und Vorrichtung zur Kontaktierung eines Kontaktelements
    ( 2001)
    Azdasht, G.
    Verfahren zur Kontaktierung eines Lichtwellenleiters mit einer metallischen Lichtwellenleiterummantelung auf einem Substrat, bei dem der Lichtwellenleiter mit thermischer Energie beaufschlagt wird, wobei der Lichtwellenleiter waehrend der Energiebeaufschlagung am Substrat anliegt und zwischen dem Lichtwellenleiter und dem Substrat eine Relativbewegung zur Positionierung des Lichtwellenleiters auf dem Substrat erfolgt, waehrend der Relativbewegung als Referenzwert fuer die Qualitaet der Relativposition des Lichtwellenleiters eine von einer Emissionsflaeche eines Laserenergie emittierenden Bauelements ausgehende, auf den Lichtwellenleiter uebertragene Referenzenergie gemessen wird, und bei Messung eines ausreichenden Referenzwertes die Relativbewegung und die Energiebeaufschlagung abgebrochen wird, dadurch gekennzeichnet, dass das Kontaktelement (17, 35) mit einer als Bondkopf (11, 33) ausgebildeten Verbindungseinrichtung gehalten wird, die gleichzeitig zur Positionierung und Energiebeaufschlagung des Kontaktelements dient, und dass zur Vorjustierung des Lichtwellenleiters (17) gegenueber der Emissionsflaeche (28) auf dem Substrat (20) eine den Lichtwellenleiterquerschnitt zumindest teilweise zwischen sich aufnehmende Positioniereinrichtung (24) vorgesehen ist, die mindestens zwei Kontaktmetallisierungserhoehungen (Bumps 22, 23) aufweist.
  • Patent
    Vorrichtung und Verfahren zum Aufbringen einer Mehrzahl von Lotkugeln auf ein Substrat
    ( 2001)
    Azdasht, G.
    ;
    Azadeh, R.
    ;
    Ruethnick, C.
    ;
    Lange, M.
    The apparatus for placing several solder balls onto a substrate incorporates a solder ball holding element (10) which channels (12) whose diameter is smaller than the diameter of the solder balls to be held. It further incorporates optical fibres (22) and an element (16) for holding them. This element is positioned so that the fibres are oriented in the direction of the respective channels in the ball holding element. The chamber (18) formed between the elements (10) and (16) can be put under a reduced pressure. The method consists of picking up and holding of solder balls as a result of reduced pressure in the chamber (18), positioning and release of them on a substrate, and melting of them by means of laser pulses through the channels (12). ADVANTAGE - Less time is required for such operations. Need for flux is obviated.