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PatentLokalisierungsvorrichtung zur Lokalisierung eines elektrischen Endgerätes( 2024-02-29)Die Offenbarung betrifft eine Lokalisierungsvorrichtung (100) zur Lokalisierung eines elektrischen Endgerätes umfassend: ein Stromnetz-Verbindungsanschluss (102), der ausgebildet ist, von einem Stromnetz eine elektrische Versorgungsleistung zu empfangen; ein Endgeräte-Verbindungsanschluss (104), der mit dem Stromnetz-Verbindungsanschluss (102) elektrisch verbunden ist und ausgebildet ist, die elektrische Versorgungsleistung dem Endgerät zur Verfügung zu stellen; eine Kennungserfassungseinheit (108), die ausgebildet ist, mittels einer Kennungsdetektoreinheit (108.2) eine Kennung (109) zu erfassen; und eine Kommunikationseinheit (106), die die Kennung (109) empfängt und ausgebildet ist, ein Kennungsübertragungssignal (107) abhängig von der Kennung zu erzeugen und zur Weitergabe an ein externes Gerät bereitzustellen.
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PublicationLaboratory X-ray Microscopy of 3D Nanostructures in the Hard X-ray Regime Enabled by a Combination of Multilayer X-ray Optics( 2024)High-resolution imaging of buried metal interconnect structures in advanced microelectronic products with full-field X-ray microscopy is demonstrated in the hard X-ray regime, i.e., at photon energies > 10 keV. The combination of two multilayer optics—a side-by-side Montel (or nested Kirkpatrick–Baez) condenser optic and a high aspect-ratio multilayer Laue lens—results in an asymmetric optical path in the transmission X-ray microscope. This optics arrangement allows the imaging of 3D nanostructures in opaque objects at a photon energy of 24.2 keV (In-Kα X-ray line). Using a Siemens star test pattern with a minimal feature size of 150 nm, it was proven that features < 150 nm can be resolved. In-Kα radiation is generated from a Ga-In alloy target using a laboratory X-ray source that employs the liquid-metal-jet technology. Since the penetration depth of X-rays into the samples is significantly larger compared to 8 keV photons used in state-of-the-art laboratory X-ray microscopes (Cu-Kα radiation), 3D-nanopattered materials and structures can be imaged nondestructively in mm to cm thick samples. This means that destructive de-processing, thinning or cross-sectioning of the samples are not needed for the visualization of interconnect structures in microelectronic products manufactured using advanced packaging technologies. The application of laboratory transmission X-ray microscopy in the hard X-ray regime is demonstrated for Cu/Cu6Sn5/Cu microbump interconnects fabricated using solid–liquid interdiffusion (SLID) bonding.
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PublicationForced Motion Activated Self-Alignment of Micro-CPV Solar Cells( 2024)
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PublicationSensor Systems for Extremely Harsh Environments( 2023-10-31)Sensors are key elements for capturing environmental properties and are today indispensable in the industry for monitoring and control of industrial processes. Many applications are demanding for highly integrated intelligent sensors to meet the requirements on safety, clean and energy efficient operation or to gain process information in the context of industry 4.0. While in many everyday objects highly integrated sensor systems are already state of the art, the situation in an industrial environment is clearly different. Frequently the use of sensor systems is impossible, due to the fact that the extreme ambient conditions of industrial processes like high operating temperatures or strong mechanical loads do not allow a reliable operation of sensitive electronic components. Eight Fraunhofer Institutes have bundled their competencies and have run the Fraunhofer Lighthouse Project ‘eHarsh’ to overcome this situation. The project goal was to realize sensor systems for extremely harsh environments, whereby sensor systems are not only pure sensor elements, rather containing one or multiple sensor elements and integrated readout electronics. Various technologies which are necessary for the realization of such sensor systems have been identified, developed and finally bundled in a technology platform. These technologies are e. g. MEMS and ceramic based sensors, SOI-CMOS based integrated electronics, board assembly and laser based joining technologies. All these developments have been accompanied by comprehensive tests, material characterization and reliability simulations. Based on the platform a pressure sensor for turbine applications has been realized to prove the performance of the eHarsh technology platform.
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PublicationWafer Level Capping Technology for Vacuum Packaging of Microbolometers( 2023-08-03)
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PatentFolienkondensator mit integriertem Wärmeableitelement und Verfahren für dessen Herstellung( 2023-07-27)Es wird ein Folienkondensator (10) vorgeschlagen, der wenigstens ein erstes Kondensatormodul (2) und ein zweites Kondensatormodul (2), die jeweils eine alternierende Abfolge von dielektrischen Kunststoffschichten (3) und elektrisch leitfähigen Metallschichten (4) umfassen und wenigstens einen ersten nach außen geführten elektrischen Anschluss (6) und wenigstens einen zweiten nach außen geführten elektrischen Anschluss (6), wobei jeder der Anschlüsse (6) mit dem ersten und mit dem zweiten Kondensatormodul (2) elektrisch leitend verbunden ist, aufweist. Weiterhin umfasst der Folienkondensator wenigstens ein erstes Wärmeableitelement (12), das zwischen dem ersten und zweiten Kondensatormodul (2) angeordnet ist und das entweder mit dem ersten oder mit dem zweiten elektrischen Anschluss (6) elektrisch leitfähig und thermisch leitfähig verbunden ist, so dass Wärme der Kondensatormodule (2), die von dem Wärmeableitelement (12) aufgenommen wird, über den entsprechend verbundenen Anschluss (6) nach außen führbar ist.
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PublicationUse of Rotary Ultrasonic Plastic Welding as a Continuous Interconnection Technology for Large-Area e-Textiles( 2023-01-28)For textile-based electronic systems with multiple contacts distributed over a large area, it is very complex to create reliable electrical and mechanical interconnections. In this work, we report for the first time on the use of rotating ultrasonic polymer welding for the continuous integration and interconnection of highly conductive ribbons with textile-integrated conductive tracks. For this purpose, the conductive ribbons are prelaminated on the bottom side with a thermoplastic film, which serves as an adhesion agent to the textile carrier, and another thermoplastic film is laminated on the top side, which serves as an electrical insulation layer. Experimental tests are used to investigate the optimum welding process parameters for each material combination. The interconnects are initially electrically measured and then tested by thermal cycling, moisture aging, buckling and washing tests, followed by electrical and optical analyses. The interconnects obtained are very low ohmic across the materials tested, with resulting contact resistances between 1 and 5 mOhm. Material-dependent results were observed in the reliability tests, with climatic and mechanical tests performing better than the wash tests for all materials. In addition, the development of a heated functional prototype demonstrates a first industrial application.
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PublicationWie die Energiewende trotz des steigenden Rohstoffbedarfes gelingen kannDie Energiewende, welche aufgrund des voranschreitenden Klimawandels notwendig ist, erfordert den Einsatz neuer Technologien mit erhöhtem Rohstoffbedarf, um die ambitionierten Ziele der Klimapolitik zu erreichen. Doch wie können wir gewährleisten, dass die potenziell kritischen Rohstoffe auch in Zukunft zur Verfügung stehen?
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PublicationOn-chip integration of optical microbottles for biosensing( 2023)In the last decades, coupling strategies of optical microresonators have been intensively explored to develop highly sensitive and label-free miniaturized biosensors. This work presents an innovative semi-automatic assembly approach for glass microbottles on a photonic integrated circuit (PIC) with single-mode waveguides. Microbottles are extraordinary whispering-gallery-mode (WGM) structures with additional axial confinement of the light along the bottle shape. A high dense spectrum of resonances varying along the bottle curvature is typically observed. To excite these resonances, the evanescent field of waveguides is used, as it provides direct evanescent interaction, integration of multiple structures and mass production. Initial coupling tests in air yielded a Q factor of 104 at 1550 nm by employing an active alignment setup and a customized gripping tool. Lateral coupling tolerances of Δx = ±50 μm and Δy = ±2 μm for a bottle diameter of 180 μm were also found. An existing assembly machine including a visual system, alignment system, high precision glue dispenser and UV light was used for the identification, placement and fixation of microbottles. A highest Q factor of 105 was determined after the attachment of a microbottle. Similar results were obtained with bio-chemical modified samples. A laser cutting method was also applied for reducing the fiber length of the microbottle. In this way the hybrid PIC can be compatible with microfluidics. The dedicated assembly process is a promising tool to bring optical resonators into practical use for label-free biochemical sensing but also for other applications such as quantum sensing and communication.
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PublicationMechanical properties of structured copper and printed silver hybrid stretchable electronic systems( 2023)Stretchable electronics can be realized using different manufacturing methods and hybrids thereof. An example of the latter is the combination of stretchable circuit boards with screen-printing, which will be discussed in this work. The hybrid stretchable electronics structures are based on photolithographically structured and rigid copper islands and screen-printed silver ink interconnections. This enables the assembly of components with a high number of contacts onto the copper islands and deformable silver ink lines between islands. The transition area between islands and lines is critical due to local stress concentration. The effect and potential mitigations were studied by measuring the electrical resistance of test interconnections under mechanical loading. The first set of samples was elongated up to 30% in tensile tests. The second set of samples was elongated 10%, 20%, and 30% in cyclic tests up to 10 000 cycles. After the tests, extensive failure analysis, e.g. scanning electron microscope, and finite element analysis were conducted. In tensile tests at maximum load, the interconnections either snap apart or their resistance increases by 640% in the transition area. Adding protective structures around the transition area, the resistance increase can be reduced to 12%. Stress concentration in the transition area can be controlled with the layout of the structures, as shown in the cyclic tests. Depending on a layout, the structures protect interconnections in the transition area (resistance <4 Ω at 10% and 20% throughout 10 000 cycles, and up to 5000 cycles at 30% elongation), or with particular designs, cause fatal damage of the circuitry and fail early. The identified failure mechanism is typically fatigue damage caused by the repeated bending of the protective structure. The observed resistance increase at the interface was closely related to the crack propagation phase in the protective structures.
