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  4. Use of Rotary Ultrasonic Plastic Welding as a Continuous Interconnection Technology for Large-Area e-Textiles
 
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January 28, 2023
Journal Article
Title

Use of Rotary Ultrasonic Plastic Welding as a Continuous Interconnection Technology for Large-Area e-Textiles

Abstract
For textile-based electronic systems with multiple contacts distributed over a large area, it is very complex to create reliable electrical and mechanical interconnections. In this work, we report for the first time on the use of rotating ultrasonic polymer welding for the continuous integration and interconnection of highly conductive ribbons with textile-integrated conductive tracks. For this purpose, the conductive ribbons are prelaminated on the bottom side with a thermoplastic film, which serves as an adhesion agent to the textile carrier, and another thermoplastic film is laminated on the top side, which serves as an electrical insulation layer. Experimental tests are used to investigate the optimum welding process parameters for each material combination. The interconnects are initially electrically measured and then tested by thermal cycling, moisture aging, buckling and washing tests, followed by electrical and optical analyses. The interconnects obtained are very low ohmic across the materials tested, with resulting contact resistances between 1 and 5 mOhm. Material-dependent results were observed in the reliability tests, with climatic and mechanical tests performing better than the wash tests for all materials. In addition, the development of a heated functional prototype demonstrates a first industrial application.
Author(s)
Dils, Christian  orcid-logo
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM  
Hohner, Sebastian
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM  
Schneider-Ramelow, Martin  
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM  
Journal
Textiles  
Open Access
DOI
10.3390/textiles3010006
Additional link
Full text
Language
English
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM  
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