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PublicationSmart sensor systems for extremely harsh environments( 2021)Sensors systems are key elements for capturing environmental properties and are increasingly important in industry 4.0 for the intelligent control of processes. However, under harsh operating conditions like high temperatures, high mechanic load or aggressive environments, standard electronics cannot be used. Eight Fraunhofer institutes have therefore bundled their competencies in sensors, microelectronics, assembly, board design, laser applications and reliability analysis to establish a technology platform for sensor systems working under extreme conditions.
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PublicationGenerative Machine Learning for Resource-Aware 5G and IoT SystemsExtrapolations predict that the sheer number of Internet-of-Things (IoT) devices will exceed 40 billion in the next five years. Hand-crafting specialized energy models and monitoring sub-systems for each type of device is error prone, costly, and sometimes infeasible. In order to detect abnormal or faulty behavior as well as inefficient resource usage autonomously, it is of tremendous importance to endow upcoming IoT and 5G devices with sufficient intelligence to deduce an energy model from their own resource usage data. Such models can in-turn be applied to predict upcoming resource consumption and to detect system behavior that deviates from normal states. To this end, we investigate a special class of undirected probabilistic graphical model, the so-called integer Markov random fields (IntMRF). On the one hand, this model learns a full generative probability distribution over all possible states of the system-allowing us to predict system states and to measure the probability of observed states. On the other hand, IntMRFs are themselves designed to consume as less resources as possible-e.g., faithful modelling of systems with an exponentially large number of states, by using only 8-bit unsigned integer arithmetic and less than 16KB memory. We explain how IntMRFs can be applied to model the resource consumption and the system behavior of an IoT device and a 5G core network component, both under various workloads. Our results suggest, that the machine learning model can represent important characteristics of our two test systems and deliver reasonable predictions of the power consumption.
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PublicationVery-Thin System-in-Package Technology for Structural Analysis( 2019)The integration of very-thin electronic systems will enable new application fields like structural analysis of components used in aviation, windmills or other critical applications. Presented are two integration options, by using flexible substrates or a RDLFirst packaging approach suitable for multiple device assembly. The RDLFirst is very thin and the flip-chip devices can be thinned also, so that the overall system gets very thin. One main difference to flexible substrate is the possible line space, which is in the region of 100um for flexible substrates and down to some um for RDLFirst.
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PublicationInterposer-based smartcard system with active wireless communication( 2017)The trend to integrate more and more functionality into smaller and smaller devices is still ongoing. Most smart systems are communicating wireless, while non-stationary systems require an integrated power supply. This paper presents a system, which is integrated into a standardized smartcard format and is capable of active wireless transmission and can be used for location detection, ranging, localization or access control. The dimension of an ISO 7816 ID-1 smartcard, which is the most common used smartcard, is about 86 by 54 mm. Integrating a smart system on this dimensions is not an problem. But the maximal height of a smartcard is only 0.76 millimeters. So integrating functionality by using multiple components is still an issue.
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PublicationPanel processing for high volume/high mix manufacturing( 2017)After long years of development, embedding of components is an established technology, used in volume manufacturing. Today most prominent is the Fan-out Wafer-level Packaging, established on 200 and 300 mm production formats. Strong development efforts are towards Panel Level Packaging on large-scale rectangular substrates. Another technology in production is the embedding using Printed Circuit Board (PCB) technologies, already using large manufacturing formats. Since many years Fraunhofer IZM is developing PCB embedding processes. Applications were demonstrated for a large range of applications, from wearables and medical applications to power systems. Embedding technology offers numerous features like miniaturization, improved electrical performance, high reliability and the potential for realizing stackable modular systems. Basically two categories of processes for embedding of active and passive components into PCB structures were developed at IZM: embedding of chips, mainly for power electronics, and embedding of SMD components.
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PublicationEarly-State Crack Detection Method for Heel-Cracks in Wire Bond Interconnects( 2014)Reliability of electronic systems is finally limited due to thermo-mechanical fatigue of interconnections. Besides soldered interconnections wire bonding is one of the most commonly used interconnection technology in electronics. Due to thermo-mechanical loading wire bond technology suffers from cracking in the heel region and delamination in the interface. To increase lifetime and lower ecological impact of electronic systems, a condition monitoring concept is needed, which is able to determine the remaining lifetime of an interconnection. The scope of this paper lies in the development of a parameter measurement system for early-state crack detection in the heel region of wire bond interconnections. This parameter measurement system uses signal components generated by cyclic opening and closing of growing cracks. So it becomes possible to determine the remaining lifetime of the interconnection, which is directly connected to the lifetime of the whole system. Furthermore an analytical model is presented, which supports the experimental setup. Measured cracks are investigated by metallographic cross-sectioning of wire bonds and focused ion beam (FIB).
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PublicationMission Profiles as an Approach to Manage Specific Automotive Requirements for Robust Design of Automotive Semiconductors( 2014)Within the scope of electrification and challenges to offer innovative and high quality products, an original equipment manufacturer has to handle the quality of the entire system. Especially the complexity and reliability of electric/electronic systems and subcomponents need to be managed. Suppliers and their sub-suppliers have to understand the environmental and application oriented loads for their products. Therefore specific environmental and functional requirements need to be provided. In this work a holistic approach to focus knowledge and experience of every part of the supply chain to develop and cover robust semiconductors is shown.
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PublicationEcodesign Requirements for servers - from single product groups to extended system approach( 2014)The currently ongoing ENTR Lot 9 preparatory study for ecodesign of enterprise server and storage equipment raises a number of methodological questions as the investigation requirements shift further from of a pure product scope to extended system analysis. The paper will give insight into the current status of the study. However, the core part of the paper will focus on the methodological aspects of addressing ecodesign on an individual product level while at the same time reflecting the extended system. The paper will explain the ecodesign implications of the various system levels, i.e. the sub-system (IT product) and extended system (support infrastructure) relationship. We then explore the options on how to cope with extended system aspects on a product scope level. The analysis will then examine existing and needed test standards, which are especially crucial for sub-system requirements.
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PublicationTranslating product specifications into environmental evidence - Carbon Footprint Models explained on the example of a netbook, a consumer laptop and an ultrabook( 2014)In a complex industry such as the electronics sector Life Cycle Assessments are still challenging. This holds true in particular for small and medium-sized enterprises with rarely any knowledge in LCA and limited resources to undertake comprehensive LCA studies. This paper describes the approach of the FP7 funded project LCA to go, which developed simplified online tools for SMEs to assess products from a selection of sectors on their own. The webtools build on embedded LCA data models and a translation of environmental impacts (Key Environmental Performance Indicators) into the technical terms found typically in the specification of computer products. As this spec has to be defined by a computer assembler anyway, he is aware of almost all the required entry data. This approach is demonstrated by establishing 3 benchmark laptop products, which can be used by SMEs to compare own designs with conventional laptops. Chosen benchmarks are a netbook, a consumer laptop 15,6? and a business ultrabook 14?. The paper outlines the methodology and shows quantified results for these 3 benchmark products. Some remaining challenges will be discussed, such as product lifetime and modelling end-of-life. This approach is not intended to replace a detailed LCA or carbon footprint study compliant with ISO 14040 or 14067, but has to be understood as an entry-level for SMEs to Life Cycle Assessments.
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PublicationTablet PCs through the lens of environment - design trends and impacts on the environmental performance( 2014)The mobile IT market is seeing a significant growth in the tablet PC shipments. The high sales numbers combined with potential short use and complex design lead to concerns about tablets? environmental relevance. In this respect, it is of specific interest to assess the environmental performance of tablets, comprising the evaluation of the design solutions with regard to repair and recycling as well as the identification of the environmentally relevant life cycle phases. 21 tablet models have been disassembled and compared in terms of non-destructive opening for repair purposes and partly destructive dismantling for end-of-life scenarios. Furthermore, an assessment of the environmental impacts associated with tablets in comparison with netbooks has been carried out. The modelling is performed using the LCA to go tool. In addition, using X-Ray Fluorescence spectrometry, the paper examines the content of critical raw materials in selected components. Quantified results from the assessments are presented.
