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Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM
Experimental and simulative study of warpage behavior for fan-out wafer-level packaging
Investigation and Modeling of Etching Through Silicon Carbide Vias (TSiCV) for SiC Interposer and Deep SiC Etching for Harsh Environment MEMS by DoE
Ferrites in Transfer-Molded Power SiPs: Challenges in Packaging
On the feasibility of fan-out wafer-level packaging of capacitive micromachined ultrasound transducers (CMUT) by using inkjet-printed redistribution layers
Low-Temperature Processible Highly Conducting Pastes for Printed Electronics Applications
Washable, Low-Temperature Cured Joints for Textile-Based Electronics
Development and characterization of a novel low-cost water-level and water quality monitoring sensor by using enhanced screen printing technology with PEDOT:PSS
Interconnecting embroidered hybrid conductive yarns by ultrasonic plastic welding for e-textiles
Washability of e-textiles: Current testing practices and the need for standardization
Flexible, stretchable, conformal electronics, and smart textiles: Environmental life cycle considerations for emerging applications