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Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM
3D integration of image sensor SiP using TSV silicon interposer
Characterization of adhesive materials for high circuit density applications
Reliability investigations for flip chip on flex using different solder materials
Integration of flip chip assembly in the SMT process: manufacturing and productivity issues
Low cost bumping by stencil printing. Process qualification for 200 mu m pitch
Implementation of flip chip technology into volume manufacturing demonstration of processes
Correlation of thermo-mechanical properties of adhesives with reliability of FC interconnections
Thermo-mechanical reliability of flip chip structures used in DCA and CSP
Reliability investigations of Sn/Pb and lead free solders for flip chip technology
Quality and yield of ultra fine pitch stencil printing for flip chip assembly
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