Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM

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  • Publication
    Fully integrated EKG shirt based on embroidered electrical interconnections with conductive yarn and miniaturized flexible electronics
    ( 2006)
    Linz, Torsten
    ;
    Kallmayer, C.
    ;
    Aschenbrenner, R.
    ;
    Reichl, H.
    A T-shirt has been developed that measures an EKG signal. This work is different to other research in the field as it focuses more on advanced interconnection and integration technologies for electronics in textiles rather than on the EKG shirt as functionality. It is the first application using an interconnection technology based on embroidery of conductive yarn that has been developed recently and published in [3].
  • Publication
    Embedding of active and passive components into printed wiring boards
    ( 2006)
    Löher, T.
    ;
    Neumann, A.
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    Vieroth, R.
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    Ostmann, A.
    ;
    Reichl, H.
    Developments of advanced electronic products and the exploitation of new application fields for microelectronic systems are increasingly accompanied by challenging physical requirements on the system. Examples are light weight for any kind of mobile system, as high as possible degree of miniaturization and robustness against chemicals and body liquids for medical implant systems, possible conformity with bend surfaces for applications in aerospace and automotive. Generally the trend towards further increase of function and component density in future electronic systems is from being saturated. On the other hand there is a considerable pressure to keep lower electronic systems prices. Embedding of active and passive components into build up layers of printed wiring boards has on the long term the potential to comply with both requirements at the same time. The European Union is funding two multinational technology development projects focussing on the embedding of chips and passive components into multilayer printed wiring boards. As examples for embedding of passive components electro less Ni(P) resistors and lamination and structuring of capacitors will be presented. For the passive components deposition control, sheet handling, trimming, lamination into build up layers and post lamination trimming options will be discussed. A technology for the embedding of active chips will be presented. The active chip is therefore thinned down to a thickness of 20 - 30 µm. The chip is then flip chip bonded onto the board wiring using ultra thin solder contacts and subsequently embedded into the laminate layer. The process flow, resulting interconnections and reliability of the systems under different loading conditions will be presented.
  • Publication
    Reliable miniaturized wireless sensors for automotive applications
    ( 2006)
    Thomasius, R.
    ;
    Grundmann, S.
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    Niedermayer, M.
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    Achterholt, R.
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    Guttowski, S.
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    John, W.
    ;
    Reichl, H.
    Moore's Law predicts the shrinking of integrated circuits. Today's rapid development in packaging technologies allows additional downscaling of self-sufficient wireless sensors from some cubic centimetre to less than 1cm3. Ongoing system miniaturization at the Fraunhofer Institute for Reliability and Microintegration (IZM) targets an edge length of 6 mm. These wireless sensors reduce the wiring complexity and mounting costs in the automotive industry while substituting signal wires by radio communication. They allow efficient solutions for applications like tire pressure monitoring systems, which requires low weighted self-sufficient sensors to reduce out-of-balance forces. Furthermore the lowering of substrate area reduces mechanical stress applied to the electronic device. Tiny wireless ultrasonic sensors and cameras mounted on external rear mirrors are further instances to monitor blind angles and to be integrated into parking distance control systems. Innovative packaging technologies and power aware design enable system shrinking considering automotive requirements. During the design process the coupling of very narrow positioned components have to be addressed. The counter measures can be selected either by software, hardware or technology. The methodologies of an ultra low power design are fundamental during the development of tiny wireless sensors to allow ultra dense system integration with innovative packaging technologies for automotive applications. Thereby exploitation of battery effects increases operation time. The relevant miniaturisation aspects are discussed on the exemplary application of a tire pressure monitoring system currently reaching 10 g in weight and five years of operation period.
  • Publication
    Chip embedding into polymer matrices of printed wiring boards
    ( 2006)
    Loeher, T.
    ;
    Neumann, A.
    ;
    Sommer, J.-P.
    ;
    Ostmann, A.
    ;
    Reichl, H.
    The functional density of electronic systems is unfailingly increasing since four decades and is expected to continue so at least within the predictable future. In electronic packaging technology strategies for densification are, however, not as streamlined as in semiconductor industries. In Europe over the past three years efforts have been made to enable functional integration on the system level by direct embedding of chips into printed wiring boards. In the EU funded projects HIDING DIES and SHIFT industrial and academic partners are combining their expertise to achieve stable technology platforms for highest integration. In the present paper two basic technology approaches and results will be presented. In the Chip in Polymer (CIP) technology silicon chips with a thickness between 50 and 80 µm are attached onto a structured core layer of a rigid printed wiring board with very high precision. The core is the laminated with resin coated copper foil on both sides, thereby embedding the chip into the build up layer. Subsequently laser vias are drilled and metallized to the chip bond pads. In the last step the outer copper sheets are structured and interconnected by either mechanical through holes or laser vias. The second approach, Flip Chip in Flex, aims at even thinner system build ups. Here an ultra thin flip chip (20 µm) is mounted onto a structured flexible printed wiring board (thickness 25 µm) and embedded into the build up layer by lamination. Contacts to different layers in the multilayered board are provided by through holes. The pros and contras of each technology will be discussed. In all of these technologies thin silicon chips are embedded into rigid or flexible printed wiring boards and connected either by laser vias or solder contacts. Process technologies, thermo-mechanical simulations of embedded chips, reliability results will be presented and discussed.
  • Publication
    Development of a nano-structure based interconnection technology
    ( 2006)
    Aschenbrenner, R.
    ;
    Fiedler, S.
    ;
    Löher, T.
    ;
    Pahl, B.
    ;
    Becker, K.-F.
    ;
    Reichl, H.
  • Publication
    Power grid analysis of CMOS devices for EMI prediction
    ( 2005)
    Köhne, H.
    ;
    Steinecke, T.
    ;
    John, W.
    ;
    Reichl, H.
    In this paper a methodology for the analysis of the dynamic supply current of digital CMOS devices is described. Especially the impact of parasitic inductance of supply lines will be investigated. Normally the dynamic current will be transmitted as conducted emission via the package to the PCB level. Together with the parasitic inductance of package and PCB traces this leads to a bounce of the IC ground level. Connected signal lines act as antennae and thus lead to radiated emission. Consequently the methodology is suitable to predict the EMI behavior of the analyzed IC. For the described di/dt-analysis the switching gates as noises sources as well as the supply lines as coupling paths will be taken into account. One major problem for performing an analysis of VLSI ICs is the complexity. This can be handled by simplifying the gate models and by analyzing only selected nets of interest.