Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM

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  • Publication
    Micro- and nanomaterials characterization by image correlation methods
    ( 2002)
    Vogel, D.
    ;
    Gollhardt, A.
    ;
    Michel, B.
    The authors present a new approach to deformation analysis based on localized correlation analysis on load state images. Displacement and strain fields are extracted from images, originating from different kinds of high resolution equipment, e.g. scanning electron and scanning force microscopes. As a result, object load response can be recorded within microscopic or nanoscopic material areas. This unique technique is utilized for deformation mapping as well as for direct determination of thermo-mechanical material properties. The method has been established as microDAC/nanoDAC for strain field mapping and as mTest for the measurement of material properties, currently coefficients of thermal expansion (CTE) and Poisson ratios. This paper includes an introduction to the measurement technique, a view on the method's capability and the developed hardware for mechanical and thermal testing. The application of the tools is illustrated by examples from electronics and microsystem packaging. Deformation measurements on chip scale packages and measurement of CTE are discussed in detail. Front-end application of correlation techniques using atomic force microscope imaging is demonstrated.
  • Publication
    Micro Materials Center Berlin: Reliability research for MEMS
    ( 2002)
    Michel, B.
    ;
    Winkler, T.
    The paper presents some recent results obtained in the field of electronic packaging for MEMS. A survey is given concerning advanced interconnection technologies (chip size packaging, BGA, wafer level packaging etc.) taking into account new developments in the field of materials research for packaging in various applications, e.g. in automotive and telecommunication systems. Special attention will be given to overcome the reliability gap which can be found in the field of microsystem reliability (e.g. high temperature electronics, lead-free solder applications in MEMS etc. New fields of applications are dealt with e.g. polytronics, micromechatronics.
  • Publication
    Numerische Beanspruchungsanalyse an mikrotechnischen Baugruppen mit Kunststoffgehäuse
    ( 1995)
    Sommer, J.-P.
    ;
    Dudek, R.
    ;
    Michel, B.
    Numerische Untersuchungen zum Verformungsverhalten von elektronischen Baugruppen und Komponenten der Mikrotechnik/Mikrosystemtechnik sind eine wirksame Hilfe für das Design von elektronischen Systemen. Finite Elemente Methoden ermöglichen in direkter Verbindung zu experimentellen Methoden eine sehr genaue Bauteilbewertung. Anhand von ausgewählten Beispielen (HF-Durchführungen in Millimeterwellen-Schaltungen) wird die Eignung der Methode nachgewiesen.
  • Publication
    Eigenspannungen in Werkstoffverbunden der Mikrosystemtechnik
    ( 1995)
    Michel, B.
    In microelectronics the problem of interconnected materials of different kind (metals, ceramics, polymeric materials) is of growing importance. Mechanical and thermal misfit problems have a dominant influence upon the reliability of electronic components and systems as well. The author deals with applications of so-called "Fracture Electronics". Several examples of electronic packaging technologies are discussed (chip cards technologies, flip chip, chip-on-board) under the special aspects of material mechanics problems.
  • Publication
    Thermal reliability assessment in SM- and COB-technology by combined experimental and finite element method
    ( 1994)
    Dudek, R.
    ;
    Michel, B.
    The authors address the issue of thermo-mechanically stressed microelectronic assemblies. An approach combining finite element simulation and advanced in-situ measuring techniques is presented. Examples deal with the application of experimental methods such as micro moiré technique, speckle pattern photography and x-ray stress analysis in connection with numerical simulations. Problems of solder joint reliability are dealt with.
  • Publication
    Experimental and numerical investigations of thermo-mechanically stressed micro-components
    ( 1994)
    Michel, B.
    ;
    Schubert, A.
    ;
    Dudek, R.
    ;
    Grosser, V.
    Reliability and fuctionality of microsystems, i.e. of small scale integrated electronic, mechanical and optical components depend on their mechanical and thermal constitution. The state of the art of microsystem design more and more requires direct "coupling" between simulation tools (including e.g. finite element modelling) and advanced physical experiments. The authors have combined various laser techniques, scanning microscopy, and x-ray diffraction with numerical field simulation. Problems of electronic packaging in microsystems are dealt with. Fracture and crack phenomena, life time estimation of microcomponents and elasto-plastic phenomena are reported.