Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM

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  • Publication
    Micro Materials Center Berlin: Reliability research for MEMS
    ( 2002)
    Michel, B.
    ;
    Winkler, T.
    The paper presents some recent results obtained in the field of electronic packaging for MEMS. A survey is given concerning advanced interconnection technologies (chip size packaging, BGA, wafer level packaging etc.) taking into account new developments in the field of materials research for packaging in various applications, e.g. in automotive and telecommunication systems. Special attention will be given to overcome the reliability gap which can be found in the field of microsystem reliability (e.g. high temperature electronics, lead-free solder applications in MEMS etc. New fields of applications are dealt with e.g. polytronics, micromechatronics.
  • Publication
    Numerische Beanspruchungsanalyse an mikrotechnischen Baugruppen mit Kunststoffgehäuse
    ( 1995)
    Sommer, J.-P.
    ;
    Dudek, R.
    ;
    Michel, B.
    Numerische Untersuchungen zum Verformungsverhalten von elektronischen Baugruppen und Komponenten der Mikrotechnik/Mikrosystemtechnik sind eine wirksame Hilfe für das Design von elektronischen Systemen. Finite Elemente Methoden ermöglichen in direkter Verbindung zu experimentellen Methoden eine sehr genaue Bauteilbewertung. Anhand von ausgewählten Beispielen (HF-Durchführungen in Millimeterwellen-Schaltungen) wird die Eignung der Methode nachgewiesen.
  • Publication
    Eigenspannungen in Werkstoffverbunden der Mikrosystemtechnik
    ( 1995)
    Michel, B.
    In microelectronics the problem of interconnected materials of different kind (metals, ceramics, polymeric materials) is of growing importance. Mechanical and thermal misfit problems have a dominant influence upon the reliability of electronic components and systems as well. The author deals with applications of so-called "Fracture Electronics". Several examples of electronic packaging technologies are discussed (chip cards technologies, flip chip, chip-on-board) under the special aspects of material mechanics problems.
  • Publication
    Thermal reliability assessment in SM- and COB-technology by combined experimental and finite element method
    ( 1994)
    Dudek, R.
    ;
    Michel, B.
    The authors address the issue of thermo-mechanically stressed microelectronic assemblies. An approach combining finite element simulation and advanced in-situ measuring techniques is presented. Examples deal with the application of experimental methods such as micro moiré technique, speckle pattern photography and x-ray stress analysis in connection with numerical simulations. Problems of solder joint reliability are dealt with.