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Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM
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PublicationApplication of nanoindentation technique to extract properties of thin films through experimental and numerical analysis( 2010)
;Wymyslowski, A. ;Dowha, L. ;Wittler, O. ;Mrossko, R.Dudek, R.One of the major topics in novel microelectronics are thin film materials - especially their mechanical properties. Accurate description of such materials is necessary in order to assess their reliability and to predict failures in electronic devices. The mechanical attributes of thin films can be determined using the nanoindentation test. However, with this equipment it is only possible to obtain estimates elastic parameters: Young's modulus and hardness of the thin layer. In the paper, it is demonstrated that with a support of numerical methods the plastic behaviour of the material can also be extracted. The numerical FEM model of the nanoindentation test was elaborated and numerical optimization algorithms were applied. The goal was to examine the elastoplastic behaviour of the investigated thin film, which is the aluminium layer in this case. Various numerical material models were used in order to decently extract the material properties of the investigated thin layer. -
PublicationInvestigations of Reliability of Lead-Free Solder Joints( 2008)
;Faust, W. ;Poller, T. ;Dudek, R.Michel, B. -
PublicationReliability of Several Sn-Based Solders under Test- and Field Fatigue Loadings( 2008)
;Dudek, R. ;Ratchev, R. ;Faust, W.Michel, B. -
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PublicationIn-situ Microscopic Studies on Microstructural Degradation and FE Analyses for Miniaturized SAC Solder Joints under Thermal Test- and Field Cycling( 2007)
;Dudek, R. ;Faust, W. ;Döring, R.Michel, B. -
PublicationReliability Analyses of Pb- and SnAgCu Solder Interconnects at Ceramic Quartz Components Subjected to Several test and Field Conditions( 2005)
;Dudek, R. ;Döring, R. ;Michel, B. ;Picault, A.Autissier, J.-F. -
PublicationLead-free flip-chip solder interconnects - materials mechanics and reliability issues( 2001)
;Schubert, A. ;Dudek, R. ;Walter, H. ;Jung, E. ;Gollhardt, A.Michel, B. -
PublicationStudies on parameters for popcorn cracking( 2001)
;Dudek, R. ;Walter, H. ;Michel, B. ;Alpern, P. ;Schmidt, R.Tilgner, R.